advanced power p-channel enhancement mode electronics corp. power mosfet lower gate charge bv dss -30v simple drive requirement r ds(on) 30m fast switching characteristic i d -21.5a rohs compliant & halogen-free description absolute maximum ratings symbol units v ds v v gs v i d @t c =25 a i d @t c =100 a i dm a p d @t c =25 w p d @t a =25 w t stg t j symbol value units rthj-c maximum thermal resistance junction-case 6 /w rthj-a 62.5 /w data and specifications subject to change without notice parameter maximum thermal resistance, junction-ambient (pcb mount) 3 -55 to 150 thermal data -30 201211281 1 + 20 -21.5 -55 to 150 20.8 2 AP4433GH-HF rating halogen-free product parameter drain-source voltage gate-source voltage continuous drain current, v gs @ 10v continuous drain current, v gs @ 10v -13.6 pulsed drain current 1 -80 total power dissipation operating junction temperature range storage temperature range total power dissipation 3 g d s ap4433 series are from advanced power innovated design and silicon process technology to achieve the lowest possible on- resistance and fast switching performance. it provides the designe r with an extreme efficient device for use in a wide range of powe r applications. the to-252 package is widely preferred for all commercial-industrial surface mount applications using infrared reflow technique and suited for high current application due to the low connection resistance. g d s to-252(h)
AP4433GH-HF electrical characteristics@t j =25 o c(unless otherwise specified) symbol parameter test conditions min. typ. max. units bv dss drain-source breakdown voltage v gs =0v, i d =-250ua -30 - - v r ds(on) static drain-source on-resistance 2 v gs =-10v, i d =-16a - - 30 m v gs =-4.5v, i d =-12a - - 50 m v gs(th) gate threshold voltage v ds =v gs , i d =-250ua -1 - -3 v g fs forward transconductance v ds =-10v, i d =-16a - 16 - s i dss drain-source leakage current v ds =-24v, v gs =0v - - -10 ua i gss gate-source leakage v gs =+ 20v, v ds =0v - - + 100 na q g total gate charge i d =-16a - 11 17.6 nc q gs gate-source charge v ds =-24v - 2.7 - nc q gd gate-drain ("miller") charge v gs =-4.5v - 6 - nc t d(on) turn-on delay time v ds =-15v - 10 - ns t r rise time i d =-16a - 43 - ns t d(off) turn-off delay time r g =3.3 -28- ns t f fall time v gs =-10v - 41 - ns c iss input capacitance v gs =0v - 1200 1920 pf c oss output capacitance v ds =-25v - 110 - pf c rss reverse transfer capacitance f=1.0mhz - 90 - pf r g gate resistance f=1.0mhz - 7 14 source-drain diode symbol parameter test conditions min. typ. max. units v sd forward on voltage 2 i s =-16a, v gs =0v - - -1.2 v t rr reverse recovery time i s =-10a, v gs =0 v , - 21 - ns q rr reverse recovery charge di/dt=100a/s - 15 - nc notes: 1.pulse width limited by max. junction temperature. 2.pulse test this product is sensitive to electrostatic discharge, please handle with caution. use of this product as a critical component in life support or other similar systems is not authorized. apec does not assume any liability arising out of the application or use of any product or circuit described herein; neither does it convey any license under its patent rights, nor the rights of others. apec reserves the right to make changes without further notice to any products herein to improve reliability, function or design. 3.surface mounted on 1 in 2 copper pad of fr4 board 2
a p4433gh-hf fig 1. typical output characteristics fig 2. typical output characteristics fig 3. on-resistance v.s. gate voltage fig 4. normalized on-resistance v.s. junction temperature fig 5. forward characteristic of fig 6. gate threshold voltage v.s. reverse diode junction temperature 3 0 20 40 60 80 0246810 -v ds , drain-to-source voltage (v) -i d , drain current (a) t c =25 o c -10v -7.0 v -6.0 v -5.0 v v g = - 4.0 v 0 10 20 30 40 50 02468 -v ds , drain-to-source voltage (v) -i d , drain current (a) -10v -7.0v -6.0v -5.0v v g = - 4.0 v t c = 150 o c 20 24 28 32 36 40 246810 -v gs , gate-to-source voltage (v) r ds(on) (m ) i d = -12 a t c =25 o c 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 -50 0 50 100 150 t j , junction temperature ( o c) normalized r ds(on) i d = -16a v g = -10v 0 0.4 0.8 1.2 1.6 2 -50 0 50 100 150 t j , junction temperature ( o c) normalized v gs(th) 0 4 8 12 16 20 0.2 0.4 0.6 0.8 1 1.2 1.4 -v sd , source-to-drain voltage (v) -i s (a) t j =25 o c t j =150 o c i d = -250ua
AP4433GH-HF fig 7. gate charge characteristics fig 8. typical capacitance characteristics fig 9. maximum safe operating area fig 10. effective transient thermal impedance fig 11. transfer characteristics fig 12. maximum continuous drain current v.s. case temperature 4 0 2 4 6 8 048121620 q g , total gate charge (nc) -v gs , gate to source voltage (v) v ds = -24v i d = -16a 0 400 800 1200 1600 2000 1 5 9 13 17 21 25 29 -v ds , drain-to-source voltage (v) c (pf) f =1.0mh z c iss c oss c rss 0.1 1 10 100 0.1 1 10 100 -v ds , drain-to-source voltage (v) -i d (a) t c =25 o c single pulse 100us 1ms 10ms 100ms dc 0.01 0.1 1 0.00001 0.0001 0.001 0.01 0.1 1 10 t , pulse width (s) normalized thermal response (r thjc ) p dm duty factor = t/t peak t j = p dm x r thjc + t c t t 0.02 0.01 0.05 0.1 0.2 duty factor=0.5 single pulse operation in this area limited by r ds(on) 0 10 20 30 40 0123456 -v gs , gate-to-source voltage (v) -i d , drain current (a) t j =150 o c t j =25 o c v ds = -5v 0 10 20 30 40 25 50 75 100 125 150 t c , case temperature ( o c ) -i d , drain current (a) t j = -40 o c
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